Semiconductor Ceramic Capacitors
Surface-Layer Ceramic Capacitors: The miniaturization of capacitors-specifically, achieving the maximum possible capacitance within the smallest possible volume-is one of the key trends in capacitor development. For discrete capacitor components, there are two fundamental approaches to achieving miniaturization: ① maximizing the dielectric constant of the dielectric material; and ② minimizing the thickness of the dielectric layer. Among ceramic materials, ferroelectric ceramics possess very high dielectric constants; however, when utilizing ferroelectric ceramics to manufacture standard ferroelectric ceramic capacitors, it is technically challenging to fabricate the ceramic dielectric layer to be sufficiently thin.
High-Voltage Ceramic Capacitors
Driven by the rapid advancement of the electronics industry, there is an urgent demand for the development of high-voltage ceramic capacitors characterized by high breakdown voltages, low power loss, compact size, and high reliability. Over the past two decades, high-voltage ceramic capacitors successfully developed both domestically and internationally have found widespread application in diverse fields, including power systems, laser power supplies, video recorders, color televisions, electron microscopes, photocopiers, office automation equipment, aerospace technology, missile systems, and marine navigation.
Multilayer Ceramic Capacitors
Multilayer ceramic capacitors (MLCCs) constitute the most widely utilized category of surface-mount components. They are fabricated by alternately stacking layers of internal electrode material and ceramic dielectric bodies in parallel configuration, which are then co-fired into a single monolithic structure. Also known as monolithic chip capacitors, these devices feature compact dimensions, high volumetric efficiency (high capacitance-to-volume ratio), and high precision. They can be surface-mounted onto printed circuit boards (PCBs) or hybrid integrated circuit (HIC) substrates, thereby effectively reducing the size and weight of electronic information terminal products-particularly portable devices-while simultaneously enhancing product reliability.